Foxconn Released Four Bid Packages for Manufacturing Plant

June 19, 2019

Foxconn Technology Group released four new bid packages recently for work on its advanced manufacturing facility in the Village of Mount Pleasant.


This latest package includes the following invitations to bid -

  • Bid Release 3c - Power Substation (PSS) Update: The invitation to bid has been revised to note that the bid package 26C duct bank work has been pushed to a future release.

  • Bid Release 5a - Fabrication Facility - Building Enclosure: This bid release includes the building enclosure packages for the construction of the Fabrication Facility.

  • Bid Release 5b - Fabrication Facility - Civil and Landscaping: This bid release includes duc​t bank, excavation, site concrete, asphalt, landscaping, excavation and site utilities.

  • Bid Release 5c - Northeast Master Plan Civil Work: This bid release includes the masterplan subdivision security (guard house), lighting, landscape, signage and telecom raceway for all private utilities in the northeast quadrant of the site.

  • Bid Release 5e - Delegated Design Buildings and Systems: This bid release includes the turn-key design build packages for specialty buildings that support the fabrication building operations.

Bid documents will be available on July 8, 2019 and a pre-bid conference and matchmaking session will be held on July 17, 2019 at Gateway Technical College (2320 Renaissance Blvd, Sturtevant).


More information about this bid package is available on

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