Foxconn Completes Roof Installation and Weathertight Enclosure of the Company’s Nearly One-Million-Square-Foot Advanced Manufacturing Facility

January 2, 2020

Six months after construction of the advanced manufacturing facility began, Foxconn achieves year-end goal with completion of weathertight enclosure

 

Milwaukee, WI – Foxconn Technology Group (Foxconn) and its construction manager Gilbane|Exyte today announced that as of the new year building enclosure is substantially complete for weather protection for the nearly one-million-square-foot advanced manufacturing facility at the Wisconsin Valley Science and Technology Park (WVSTP).

 

“Thanks to the hard work of the Gilbane|Exyte team, along with dozens of Wisconsin companies and their employees, Foxconn is able to celebrate this significant milestone,” said a Foxconn spokesperson. “Building enclosure being substantially complete for weather protection meets our year-end goal that began with an aggressive construction schedule. As Foxconn heads in 2020, the company will play an important role in Wisconsin’s development as a global technology hub that will drive further investment and job creation.”

 

Information regarding these bid packages and all current bid opportunities for the project, as well as previous bid awards for work at the WVSTP to date can be found at: https://wisconnvalley.wi.gov/Pages/ScienceTechPark.aspx.

Businesses interested in applying for competitive bids packages with Mortenson for Foxconn’s other facilities such as the Smart Manufacturing Center (SMC) and High-Performance Computing Data Center (HPCDC) are asked to visit wisconnvalley.wi.gov for upcoming opportunities and to register at https://bit.ly/2k9Qn5V.

Students, recent college graduates, job-seekers and veterans interested in pursuing careers in fields such as high-performance computing, smart manufacturing, industrial big data, cloud computing, smart display and industrial artificial intelligence are invited to visit foxconnjobs.us to learn more.

 

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